ENIG
Electroless nickel, immersion gold. Flat, long shelf life, fine-pitch friendly, good for press-fit and edge contacts. The default for anything with a BGA.
- Shelf life12 months
- FlatnessExcellent
- CostHigh
Capabilities
The spec sheet.
Everything the line will hold, written down. If your design sits outside any of it, say so on the quote request. Several of these move with volume and lead time.
- Layers2 – 30
- Max panel500 × 600 mm
- Min board size6 × 6 mm
- Finished thickness0.4 – 3.2 mm
- Thickness tolerance±10%
- Copper, outer0.5 – 6 oz
- Copper, inner0.5 – 4 oz
- Min track / gap0.075 mm (3 mil)
- Min mechanical drill0.15 mm
- Min laser microvia0.10 mm
- Min annular ring0.075 mm
- Max aspect ratio12 : 1
- Hole position tol.±0.05 mm
- Outline tolerance±0.1 mm
- Impedance tolerance±10% standard, ±5% on request
- Soldermask registration±0.05 mm
- Soldermask dam, min0.075 mm
- Silkscreen line, min0.12 mm
- Countersink / counterboreYes
- Edge platingYes
- Castellated holesYes
- Back-drillYes
- Via fill & capResin / copper
- Panel releaseV-score · tab-route · jump-score
Stack-up & impedance
The stack is the design.
Impedance isn't a setting, it's geometry. Track width, the copper weight, how far the track sits from its reference plane, and the dielectric constant of the resin in between. Change any one and the number moves.
So we build the stack-up against the real material we'll press, not a generic 4.5 Dk, and we send it to you before anything is imaged. If your target can't be hit within the board thickness you've specified, you hear that at quote stage.
- FR-4, standardTg 140 °C
- FR-4, midTg 150 / 170 °C
- FR-4, highTg 180 °C, low CTE
- Halogen-freeAvailable on all Tg
- High frequencyRogers 4350B · 4003C
- High frequencyRO3003 · hybrid stacks
- FlexiblePolyimide, 1 – 6 layer
- ThermalAluminium IMS, 1 – 2 layer
- Heavy copperUp to 6 oz outer
- Typical Dk range3.0 – 4.6
- CouponOn panel, measured & reported
- Test methodTDR, IPC-TM-650
Surface finish
Pick the finish for the job, not the price.
Immersion silver / tin
Flat and solderable at lower cost than ENIG. Silver tarnishes if stored badly; tin has a shorter window. Good for high-volume consumer work.
- Shelf life6 months
- FlatnessExcellent
- CostMedium
OSP & lead-free HASL
OSP is cheapest and flat but single-reflow in practice. HASL is rugged and cheap but uneven. Fine for through-hole and 0603 and up, wrong for fine pitch.
- Shelf life6 / 12 months
- FlatnessGood / poor
- CostLow
Assembly & test
Built, then proven.
A placement machine will happily put a part down in the wrong orientation all day. Which is why nothing leaves on the assumption that it was built right. Every joint is inspected, every net is tested, and every BGA is X-rayed.
Reflow profiles are matched to your board's thermal mass rather than run from a house default, and the profile for your part number is recorded with the lot.
- Smallest passive01005
- Min BGA / CSP pitch0.3 mm
- Max component height25 mm
- PackagesQFN · LGA · QFP · PoP
- Bottom-terminatedYes, X-ray verified
- Through-holeSelective & wave solder
- Press-fitYes
- Double-sided reflowYes
- Conformal coatingAcrylic / silicone
- PottingOn request
- Electrical test100%, flying probe or fixture
- Functional testTo your test spec
Outside the spec? Ask anyway.
Half of these numbers move with quantity and lead time. Tell us what the design actually needs and we'll tell you whether it's buildable here, and what it costs.